| 器件名 | 厂商 | 描 述 | 功能 |
|---|---|---|---|
| IDG-300 | InvenSense (TDK ) | Analog Circuit, PQCC40 | 下载 |
| IDG-300B | InvenSense (TDK ) | Analog Circuit | 下载 |
| 对应元器件 | pdf文档资料下载 |
|---|---|
| IDGV1G-05A1F1C-40X 、 IDGV1G-05A1F1C-50X 、 IDGV1G-05A1F1C-55X | 下载文档 |
| IDGV51-05A1F1C-40X 、 IDGV51-05A1F1C-50X | 下载文档 |
| IDGV1G-05A1F1C-45X | 下载文档 |
| IDGV51-05A1F1C-45X | 下载文档 |
| IDG-2030U | 下载文档 |
| IDG-300B | 下载文档 |
| IDG-2020 | 下载文档 |
| IDG-300 | 下载文档 |
| 型号 | IDGV1G-05A1F1C-40X | IDGV1G-05A1F1C-50X | IDGV1G-05A1F1C-55X |
|---|---|---|---|
| 描述 | Synchronous Graphics RAM, 32MX32, CMOS, PBGA170, GREEN, PLASTIC, TFBGA-170 | Synchronous Graphics RAM, 32MX32, CMOS, PBGA170, GREEN, PLASTIC, TFBGA-170 | Synchronous Graphics RAM, 32MX32, CMOS, PBGA170, GREEN, PLASTIC, TFBGA-170 |
| 厂商名称 | QIMONDA | QIMONDA | QIMONDA |
| 零件包装代码 | BGA | BGA | BGA |
| 包装说明 | TFBGA, | TFBGA, | TFBGA, |
| 针数 | 170 | 170 | 170 |
| Reach Compliance Code | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 |
| 访问模式 | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST |
| 其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| 备用内存宽度 | 16 | 16 | 16 |
| JESD-30 代码 | R-PBGA-B170 | R-PBGA-B170 | R-PBGA-B170 |
| 长度 | 14 mm | 14 mm | 14 mm |
| 内存密度 | 1073741824 bit | 1073741824 bit | 1073741824 bit |
| 内存集成电路类型 | SYNCHRONOUS GRAPHICS RAM | SYNCHRONOUS GRAPHICS RAM | SYNCHRONOUS GRAPHICS RAM |
| 内存宽度 | 32 | 32 | 32 |
| 功能数量 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 |
| 端子数量 | 170 | 170 | 170 |
| 字数 | 33554432 words | 33554432 words | 33554432 words |
| 字数代码 | 32000000 | 32000000 | 32000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C |
| 组织 | 32MX32 | 32MX32 | 32MX32 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TFBGA | TFBGA | TFBGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm |
| 自我刷新 | YES | YES | YES |
| 最大供电电压 (Vsup) | 1.545 V | 1.545 V | 1.545 V |
| 最小供电电压 (Vsup) | 1.455 V | 1.455 V | 1.455 V |
| 标称供电电压 (Vsup) | 1.5 V | 1.5 V | 1.5 V |
| 表面贴装 | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | OTHER |
| 端子形式 | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM |
| 宽度 | 12 mm | 12 mm | 12 mm |
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